| Triye | atik yo | Kapasite nòmal | Kapasite espesyal |
| konte kouch | PCB rijid-flex | 2-14 | 2-24 |
| Flex PCB | 1-10 | 1-12 | |
| tablo | 0.08 +/- 0.03mm | 0.05 +/- 0.03mm | |
| Min.Epesè | |||
| Max.Epesè | 6mm | 8mm | |
| Max.Gwosè | 485mm * 1000mm | 485mm * 1500mm | |
| Twou & Fant | Min.Hole | 0.15mm | 0.05mm |
| Min.Slot Twou | 0.6mm | 0.5mm | |
| Aspè rapò | 10:01 | 12:01 | |
| Tras | Min.Width / Espas | 0.05 / 0.05mm | 0.025 / 0.025mm |
| Tolerans | Tras W/S | ± 0.03mm | ± 0.02mm |
| (W/S≥0.3mm:±10%) | (W/S≥0.2mm:±10%) | ||
| Twou a twou | ± 0.075mm | ± 0.05mm | |
| Dimansyon twou | ± 0.075mm | ± 0.05mm | |
| Enpedans | 0 ≤ Valè ≤ 50Ω : ± 5Ω 50Ω ≤ Valè : ± 10%Ω | ||
| Materyèl | Espesifikasyon Basefilm | PI : 3mil 2mil 1mil 0.8mil 0.5mil | |
| ED&RA Cu: 2OZ 1OZ 1 / 2OZ 1 / 3OZ 1 / 4OZ | |||
| Basefilm prensipal founisè | Shengyi / Taiflex / Dupont / Doosan / Thinflex | ||
| Spesifikasyon Coverlay | PI : 2mil 1mil 0.5mil | ||
| Koulè LPI | Vèt / Jòn / Blan / Nwa / Ble / Wouj | ||
| PI Stiffener | T: 25um ~ 250um | ||
| FR4 rèd | T: 100um ~ 2000um | ||
| SUS Stiffener | T: 100um ~ 400um | ||
| AL Stiffener | T: 100um ~ 1600um | ||
| Tep | 3M / Tesa / Nitto | ||
| EMI pwoteksyon | Silver fim / Copper / Lank ajan | ||
| Sifas fini | OSP | 0.1 - 0.3um | |
| HASL | Sn: 5um - 40um | ||
| HASL (Leed gratis) | Sn: 5um - 40um | ||
| ENEPIG | Ni: 1.0 - 6.0um | ||
| Ba: 0.015-0.10um | |||
| Au : 0.015 - 0.10um | |||
| Plating di lò | Ni: 1.0 - 6.0um | ||
| Au: 0.02um - 1um | |||
| Flash lò | Ni: 1.0 - 6.0um | ||
| Au: 0.02um - 0.1um | |||
| ENIG | Ni: 1.0 - 6.0um | ||
| Au: 0.015um - 0.10um | |||
| Immersion ajan | Ag: 0.1 - 0.3um | ||
| Plating fèblan | Sn: 5um - 35um | ||
| SMT | Kalite | Konektè anplasman 0.3mm | |
| 0.4mm anplasman BGA / QFP / QFN | |||
| 0201 Eleman |