| Pwojè | Kontni | Kapabibty |
| 1 | klasifikasyon tablo | Aliminyòm baz, kwiv baz, seramik baz kwiv, konbine Bade Board |
| 2 | materyèl | Domestik aliminyòm.Domestik kwiv,Enpòte aliminyòm, Enpòte kwiv |
| 3 | tretman sifas yo | HASL/ENIG/OSP/sikering |
| 4 | kont kouch | yon sèl-sided pnnted tablo / doub-sided enprime tablo |
| 5 | maxi.Board Size | 1200mm * 480m (n |
| 6 | min.Board Size | 5mm * 5mm |
| 7 | lajè liy/absè | 0.1mnV0.1mm |
| 8 | chèn ak tòde | <= 0.5% (tfiickness: 1. Omm, Gwosè tablo: 300mm * 300mm) |
| 9 | epesè tablo | 0.5mm-5.0mm |
| 10 | epesè papye kwiv | 35urrV70um/105um/140um/175unV210um/245um/280um/315um/35Qjm |
| 11 | tolerans | CNC routage: ± 0.1 mm; kout pyen: 士 0.1 mm |
| 12 | V-CUT anrejistreman | ± 0.1mm |
| 13 | Twou miray epesè kwiv | 20um-35um |
| 14 | Mm anrejistreman pozisyon twou (kanpe ak done CAD) | ± 3mil (10.076mm) |
| 15 | Min.punching twou | 1.0mm (epesè tablo bebw1.0mmr1.0mm) |
| 16 | Min.punching kare emplacement | (Epesè tablo anba a 1 .Omm, 1.0mm * 1 .Omm) |
| 17 | Enskripsyon sikwi enprime | ± 0.076mm |
| 18 | Min.drill dyamèt twou | 0.6mm |
| 19 | epesè nan tretman sifas yo | plating lò: Ni 4um-6um> Au0.1um-0.5umENIG:Ni 5um-6um,Au:0.0254um-0.127umajan: Ag3um-8umHASL:40um-1 OOum |
| 20 | V-CUTdegree tolerans | (Degre) |
| 21 | V-CUT tablo epesè | 0.6mm-4.0mm |
| 22 | Min.legend lajè | 0.15mm |
| 23 | Min.Soldor mask ouvèti | 0.35mm |